发明名称 |
DRY ETCHING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A magnetic field plasma generation apparatus is provided which can make a stable and uniform discharge in a low pressure and a low ion current density, and where ion current density and the distribution of etching rate in a plane are uniform. And also a method is provided for fabricating a semiconductor device using the plasma generation apparatus. CONSTITUTION: In a dry etching, a high anisotropy and a low gate breakdown are accomplished. Plasma is generated by ECR(Electron Cyclotron. Resonance) resonance of an electromagnetic wave and a magnetic field generated by that UHF power is supplied to a micro strip line(4) installed in a surface in the side of atmosphere of a dielectric(2) separating the inside and outside of vacuum. And a conductive film is dry-etched by the plasma. Therefore, a stable and uniform plasma can be generated.
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申请公布号 |
KR20000052572(A) |
申请公布日期 |
2000.08.25 |
申请号 |
KR19990062509 |
申请日期 |
1999.12.27 |
申请人 |
HITACHI. LTD. |
发明人 |
KOHUZINAOYUKI;MORIMASAHITO;YOKOGAWAKENEZ;ITABASINAOSI;ZZIMOTOKAZNORI;TACHISINICHI |
分类号 |
H01L21/302;C23F4/00;H01J37/32;H01L21/00;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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