| 摘要 |
PURPOSE: A non-electrolytic complex plating solution which forms smooth and uniform complex plating film and keeps plating properties such as rate of vacancy and separation rate for a long time after use and a non-electrolytic complex plating method are provided CONSTITUTION: A non-electrolytic complex plating solution comprises: (i) a metal ion; (ii) a chelating agent of the metal ion; (iii) a hypo-phosphite functioning as a reducing agent; (iv) a surfactant; and (v) a water-insoluble complex materials, wherein the surfactant comprises a quaternary ammonium salt surfactant having more than two groups of ethyleneoxide group and alkyl group or fluoro-substituted alkyl group or alkenyl group and the quaternary ammonium salt surfactant is naturally cationic or substantially shows cationic property under pH condition of the plating solution. The non-electrolytic complex plating method comprises steps of: (i) providing the non-electrolytic complex plating solution; and (ii) forming a complex plating film where the complex materials is dispersed on a mother metal based on the metal ion on the materials to be plated by immersing the materials to be plated in the plating solution.
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