| 摘要 |
PURPOSE: A present invention relates generally to a planarization apparatus and method, and more particularly to a planarization apparatus and method for planarizing the reverse of a semiconductor wafer on which no chip has been formed yet in a semiconductor wafer manufacturing process to improve the throughput without damaging a workpiece. CONSTITUTION: A polishing stage (22) is mounted on a body (12) provided with a rough grinding stage (18) and a fine grinding stage (20) so that a wafer (28) can be roughly ground, finely ground and polished in one planarization apparatus (10). The planarization apparatus (10) also has a cleaning stage (23) for cleaning a polishing pad (56) of the polishing stage (22) to thereby clean the dirty cleaning pad (56). The planarization apparatus (10) is also provided with an etching unit (150, 190) to thereby perform a sequence of planarization from the rough grinding to the etching. |
