| 摘要 |
PURPOSE: An electronic parts device is provided for an electronic component part device such as a semiconductor device in which semiconductor chips can be connected to a packaging substrate of multi-layer wiring board and which has a superior long-term connection reliability. CONSTITUTION: In regard to a packaging substrate 20 on which a semiconductor chip 10 is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation 32 and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation 31 and 33 by the subtractive process, and solder coating to obtain the packaging substrate 20. The bump electrode 11 of the semiconductor chip and the packaging substrate are connected through an adhesive film 40. |
