发明名称 HYBRID LIGHT EMITTING DEVICE, SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PURPOSE: A method for manufacturing a semiconductor light emitting device is provided to improve a durability of static electricity regarding a high voltage by using a sub-mount element as a static electricity protection element. CONSTITUTION: A method for manufacturing a semiconductor light emitting device comprises the steps of: forming a stacked element including a first semiconductor layer of a first conductivity and a second semiconductor layer of a second conductivity on a substrate having a light penetration, and forming an electrode on the stacked element to make the light emitting device; forming a sub-mount element having an opposite electrode in a position opposite to the electrode of the light emitting device on a main surface; forming a micro bump on the electrode and the opposite electrode; having the stacked element and the main surface of the opposite electrode face each other and maintaining the light emitting device on the sub-mount element, so that the electrode of the light emitting device is electrically connected to the opposite electrode through the micro bump; and applying a wavelength transforming resin material including either one of a fluorescent material or a filter material to coat the light emitting device while having the main surface of the sub-mount element as a maintaining part of the wavelength transforming resin material.
申请公布号 KR20000053441(A) 申请公布日期 2000.08.25
申请号 KR20000001078 申请日期 2000.01.11
申请人 MATSUSHITA ELECTRONICS CORPORATION 发明人 MAEDA, DOSIHIDE;OBARA, GUNIHIKO;INOUE, DOMIO
分类号 H01L25/16;H01L33/32;H01L33/38;H01L33/50;H01L33/54;H01L33/56;H01L33/62;H01S5/323 主分类号 H01L25/16
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