| 摘要 |
<p>An epoxy resin composition which comprised, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which is liquid at ordinary temperatures and has two or more glycidyl groups in a molecule thereof, (b) 3 to 80 parts by weight of a curing agent, and (c) 1 to 100 parts by weight of a modified epoxy resin. The composition is suitable as an underfill sealing agent, is capable of curing in a short time, resulting in a high productivity of a cured product, and also is sure to connect a semiconductor device such as a CSP or BGA to a wiring board through curing at a relatively low temperature with no adverse effect on parts on the wiring board, is excellent in the resistance to heat shock (temperature cycling) and to impact, is free from the problem of bleeding of contaminants from a cured product, and is advantageous in that, when a defect is found, CSP and BGA can be removed from the wiring board and thus reuse can be made of the wiring board and semiconductor devices functioning normally.</p> |
