PACKAGING FOR A SEMICONDUCTOR CHIP

摘要

The invention relates to packaging for a semiconductor chip (10), in which the semiconductor chip (10) is bonded to an interposer (20), which has a central opening (26) over a central bonding pad area (16) of the semiconductor chip (10). Wire bridges (40) passing through said central opening (26) lead from bonding pads (18) on the semiconductor chip (10) to connecting pads (36) on the interposer (20). The invention also relates to a semiconductor component and a memory module having corresponding characteristics, as well as to a method of production used notably for the production of a semiconductor component of this kind.