Integrierter Halbleiterchip mit über Bondpads voreingestellter Dateneingabe-/Datenausgabe-Organisationsform

摘要

The semiconductor chip has bonding pads (IOP) to exchange input and output data, which can be preset for one of several possible data input/output organization forms (DQ4,DQ8). Not all of the bonding pads are used in normal use. All the bonding pads are connected to external connectors. The semiconductor chip has an altered input/output organization form, so that bonding pads not used in normal use are used in the test operation.