发明名称 |
ELECTRODE FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
An electrode for a semiconductor device which can be excellently die-bonded or wire-bonded to a sub-mount, wherein the electrode is formed on a semiconductor in ohmic contact therewith and comprises an underlying layer electrode (E1) formed on the semiconductor in a layered structure and an overlying layer electrode (E2) covering the top and/or side surface of the underlying layer electrode (E1), and the overlying layer electrode is formed by a vapor deposition device or a sputtering device which has a holder tilted with respect to the electrode material and capable of rotating and revolving.
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申请公布号 |
CA2328907(A1) |
申请公布日期 |
2000.08.24 |
申请号 |
CA20002328907 |
申请日期 |
2000.02.17 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
TSUKIJI, NAOKI;NAKAJIMA, AKIFUMI;TOYOSAKI, KOICHI |
分类号 |
H01L21/285;H01L29/45;H01S5/042;(IPC1-7):H01L21/28;H01L29/43 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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