发明名称 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE SUITABLE FOR SURFACE MOUNTING |
摘要 |
<p>A method of manufacturing a semiconductor device suitable for surface mounting whereby semiconductor elements are interconnected into a coherent row of semiconductor elements by means of conductive strips such that a connection point of a certain semiconductor element is connected to a connection point of a semiconductor element preceding it in the row by means of a strip, and another connection point of said certain semiconductor element is connected to a connection point of a semiconductor element following it in the row, and the row of semiconductor elements is enveloped in a protective material, and the semiconductor elements are mutually separated into individual semiconductor devices provided with two side faces, each side face having a portion of the strip which is processed into a connection conductor in that an electrically conducting layer is provided on the side faces contacting said portion of the strip.</p> |
申请公布号 |
EP0770266(B1) |
申请公布日期 |
2000.08.23 |
申请号 |
EP19960910160 |
申请日期 |
1996.05.07 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
SANDERS, KLAASTINUS, HENDRIKUS;DUINKERKEN, GEERT, JOHANNES |
分类号 |
H01L21/56;H01L21/78;H01L23/31;H01L23/48;H01L23/495;H04N7/01;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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