发明名称 Fluid control apparatus and method for spray cooling
摘要 A fluid control apparatus is adapted for use with a spray plate 100 having at least one atomizer 120 which cools an associated printed circuit board 200 carrying one or more heat-generating components such as integrated circuits 220. At least one spray plate and printed circuit board are carried within a coolant-tight enclosure such as a spray module 300. A preferred shroud 20 is supported by the spray plate. The shroud encloses a spray cavity 24 and provides control over the flow and direction of the spray coolant leaving the atomizers enclosed by the shroud. Control over the flow and direction of the coolant spray better cools the components carried on the printed circuit board and partially enclosed by the shroud.
申请公布号 US6108201(A) 申请公布日期 2000.08.22
申请号 US19990255415 申请日期 1999.02.22
申请人 TILTON, CHARLES L;WEILER, JEFFERY K;TILTON, DONALD E 发明人 TILTON, CHARLES L;WEILER, JEFFERY K;TILTON, DONALD E
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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