发明名称 Dispensing nozzle for a die bonder
摘要 <p>The machine has a baffle (21) for throttling the flow of adhesive (5) in the feed channel (7) leading to the nozzle exit, so that when adhesive is added to fill the nozzle, the leading edge (12) of the flowing adhesive is directed in a predetermined flow direction, forcing all of the gas (15) in the feed channel out through the nozzle exit holes (10, 10a). An Independent claim is included for the use of this nozzle in the dispensing part of a die bonding machine.</p>
申请公布号 SG74689(A1) 申请公布日期 2000.08.22
申请号 SG19990000022 申请日期 1999.01.06
申请人 ESEC SA 发明人 BARALDI LUCA
分类号 H01L21/52;B05C5/02;(IPC1-7):B05B1/00 主分类号 H01L21/52
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