| 摘要 |
PROBLEM TO BE SOLVED: To prevent a thermal stress from being developed owing to the difference of the coefficient of thermal expansion between a semiconductor device or a semiconductor package and a mounting substrate and the degradation of reliability in a temperature cycle, eliminate a risk that a steam explosion occurs in the package in a manufacturing process, and also facilitate the repairing work in the semiconductor mounting device where the electrodes (solder bumps) of the semiconductor device or the semiconductor package are connected with the corresponding parts of the wiring films of the mounting substrate. SOLUTION: Contact pins 7 are formed in the portions where the electrode (solder bumps) 3 of a semiconductor device or a semiconductor package 1 are connected to the electrodes 3 of the wiring films 6 of a mounting substrate 4. The pins 7 are stuck to the electrodes (solder bumps) of the semiconductor device or the semiconductor package 1, and the electrodes 3 of the semiconductor device or the semiconductor package 1 are connected to the wiring films 6 of the mounting substrate 4.
|
