| 发明名称 |
Thermal conditioning apparatus |
| 摘要 |
A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.
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| 申请公布号 |
US6107609(A) |
申请公布日期 |
2000.08.22 |
| 申请号 |
US19990250366 |
申请日期 |
1999.02.12 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
STRODTBECK, TIMOTHY A.;MOLEBASH, JOHN S.;HAYES, BRUCE L.;SMITH, REX A.;DAVIS, SHAWN D. |
| 分类号 |
B25B11/00;H01L21/00;H01L21/687;(IPC1-7):H05B3/68;H05B1/02;B05C11/00 |
主分类号 |
B25B11/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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