| 摘要 |
PROBLEM TO BE SOLVED: To mount plural types of semiconductor chips different in sizes. SOLUTION: In a semiconductor integrated circuit device 10, semiconductor chips CP are mounted on the center of a substrate for semiconductor integrated circuit device 1. The substrate for semiconductor integrated circuit device 1 has circuit pattern strings 12 (12a-12d) formed of plural circuit patterns 3 installed along the respective sides of a substrate body 2. Pads for bonding 4a-4c are installed in the circuit patterns 3 at the centers of the circuit pattern strings 12 and plural types of semiconductor chips different in sizes can be loaded. Only one pad for bonding 4c is installed in the circuit pattern at the end of the circuit pattern string 12. |
