| 摘要 |
PROBLEM TO BE SOLVED: To provide the IC card which is manufactured at low cost and has an attractive surface by preventing the quality of the card surface from decreasing after the completion. SOLUTION: This IC card is thermally formed by a thermal laminating method, etc., by sandwiching between thermoplastic sheets an IC module having an electronic circuit pattern 12 and an IC chip 11 formed on a printed board sheet 10 of PET(polyethylene terephthalate), polyamide, etc., which is hard to thermally melt-stick. In this case, many holes 13 for melt-sticking are formed on the printed board sheet 10 before thermal forming except the electronic circuit and IC chip so as to improve the adhesive strength. |
