Low application temperature hot melt adhesive comprising ethylene alpha -olefin

摘要

PCT No. PCT/US97/12366 Sec. 371 Date Jan. 8, 1998 Sec. 102(e) Date Jan. 8, 1998 PCT Filed Jul. 21, 1997 PCT Pub. No. WO98/03603 PCT Pub. Date Jan. 29, 1998Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350 DEG F. (177 DEG C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C2-C20 alpha -olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150 DEG C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.