| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which can provide a good contact between semiconductor and wiring via an insulating layer. SOLUTION: A semiconductor manufacturing apparatus 40 includes an etching chamber, a heating chamber 43 having a facility for heating a substrate, and a transfer chamber 46 which communicates with the etching chamber and the heating chamber 43. The heating chamber 43 may be provided with an ultraviolet-ray lamp, and the lamp may be provided inside or outside of the chamber 46. The heating chamber 46 may have a means for supplying oxygen(O2) or ozone(O3) gas.
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