发明名称 |
Semiconductor thermal protection arrangement |
摘要 |
A cooling assembly for semiconductor devices in the form of an enclosure including an inlet and outlet with a semiconductor support assembly is presented. The air passage connection with the inlet defines vortex configuration for the rapid transport of compressed air to the semiconductor devices arranged between the enclosure inlet and outlet.
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申请公布号 |
US6108206(A) |
申请公布日期 |
2000.08.22 |
申请号 |
US19990337095 |
申请日期 |
1999.06.21 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
CRINITI, JOSEPH;LARRANAGA, JAVIER I.;KIM, EDWARD E.;SANTOS, ESTEBAN;VICENTE, NATHANIEL B. |
分类号 |
H01L23/467;H05K7/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/467 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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