Method and apparatus for measuring temperatures during electronic package assembly

摘要

A novel technique for measuring the temperature of an electronic circuit undergoing assembly packaging processes includes a non-contact infrared detector which is used to measure the temperature of the die allowing a control systems to directly adjust the die temperature. Previous to this invention, the die temperatures were controlled indirectly, typically by controlling ambient temperature in an oven or furnace to a series of set point values during curing of the electronic packaging materials.