| 摘要 |
PROBLEM TO BE SOLVED: To accurately detect the defects of a wafer by detecting the positions and the number of defects by excluding defects which are detected by first inspections, but not detected at the same positions by second inspections, from the defects detected by the first and second inspections. SOLUTION: The positions and the number of defects of a wafer WF are detected by performing first inspections by means of a defect inspection machine 1 used for inspecting the wafer WF before the wafer WF is worked by means of a semiconductor manufacturing apparatus and stored in the memory area 5a of a memory 5. Then the positions and the number of defects of the wafer WF are detected by performing second inspections after the wafer WF is worked and stored in the memory area 5b of the memory. Then the positions and the number of defects of the wafer WF are detected by excluding the defects which are detected by the first inspections, but not detected by second inspections, from the defects stored in the memory area 5a and 5b.
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