| 摘要 |
PROBLEM TO BE SOLVED: To shorten a connecting distance between a terminal and a circuit pattern of a substrate and to efficiently externally dissipate a heat generated from a semiconductor chip. SOLUTION: The semiconductor integrated circuit device 10 mounts a first semiconductor chip 16 on a lower surface 26 of a substrate 12 by face down bonding covering an opening 14. A plurality of solder balls 20 are provided in matrix state on a periphery of a first semiconductor integrated circuit 16. A second semiconductor chip 2 is mounted on an upper surface 27 of the substrate 12 by face down bonding covering the opening 14. A sealing resin 28 having high thermal conductivity is filled in a gap surrounded by the opening 14, the chips 16, 22, and the substrate 12. |
