| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of preventing a deformation due to a mechanical pressure and a stress and a semiconductor device of chip- on-chip structure. SOLUTION: A slave chip 2 is supported above a master chip 1 by connecting a slave side bump B2 to a corresponding master side bump B1. The bumps B1 and the bumps B2 contain a functional bump B1 and the bump B2. The chip 1 is electrically connected to the chip 2 by connecting the bumps BF to each other, and the connection of the bumps BD does not contribute to electric connection of the chip 1 and the chip 2. That is, since a dummy bump which does not contribute to the electric connection to a solid is formed on an opposed surface of another semiconductor chip to a solid surface (substantially flat surface) of a circuit board or the like, in addition to the functional bump for the electric connection to the slid, a force operating the chip can be dispersed in the case of connecting the chip to the solid to seal it with resin or the like. |
