This is a device package comprising: a leadframe 54 comprising a plurality of leads for effecting circuit connections to a device 30; and a metal ground piece 52 connected to the leadframe 12. Other devices and methods are also disclosed. <IMAGE>
申请公布号
SG74556(A1)
申请公布日期
2000.08.22
申请号
SG19960007644
申请日期
1993.10.26
申请人
TEXAS INSTRUMENTS INCORPORATED
发明人
DAVIS, DENNIS, D.;BARNETT JOHN;CARTER, BUFORD, H.;LAHUTSKY, TAMMY, J.;HAAS, GLEN, R., JR.
