发明名称 |
Semiconductor device |
摘要 |
<p>To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle. <IMAGE></p> |
申请公布号 |
SG74680(A1) |
申请公布日期 |
2000.08.22 |
申请号 |
SG19980005254 |
申请日期 |
1998.12.07 |
申请人 |
HITACHI ULSI SYSTEMS CO., LTD.;HITACHI, LTD. |
发明人 |
AZUMA SHUICHIRO;OKINAGA TAKAYUKI;EMATA TAKASHI;KUDAISHI TOMOAKI;WADA TAMAKI;NISHI KUNIHIKO;MASUDA MASACHIKA;SUGANO TOSHIO |
分类号 |
H01L25/00;G11C5/00;H01L23/50;H01L25/10;H01L25/18;H05K3/30;(IPC1-7):H01L25/065;H01L23/495 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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