| 摘要 |
PROBLEM TO BE SOLVED: To provide the card, such as a magnetic card and an IC card, which has mechanical characteristics, heat resistance, and embossing working. SOLUTION: This card is a card formed of resin (composition) having thermoplastic resin as a matrix and has >=30 MPa upper yield point stress σ, >=0.1% upper yield point elongation ε, and a <=2400 MPa modulus E of elasticity by a tension test taken according to the rule ASTM D-638 so that E/(σ.ε)>=5.5. |
