发明名称 IMAGE SENSOR STRUCTURE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an image sensor structure, wherein damage to a base at the time of the formation of a contact is suppressed without complicating the manufacturing process of the image sensor structure, and the manufacturing method of the structure. SOLUTION: In an image sensor having a first interlayer film which covers a thin film transistor part, and a recessed interlayer film 11 which covers the first interlayer film and a light-receiving element part, the first and second interlayer films are respectively constituted of different materials. After the second interlayer film on a contact formation part in the thin film transistor part consisting of a polysilicon film is at least removed, a contact is formed.
申请公布号 JP2000232215(A) 申请公布日期 2000.08.22
申请号 JP19990034635 申请日期 1999.02.12
申请人 NEC CORP 发明人 MATSUNO FUMIHIKO
分类号 H04N1/028;H01L21/77;H01L21/84;H01L27/12;H01L27/14;H01L27/146;H01L29/423;(IPC1-7):H01L27/146 主分类号 H04N1/028
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