| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat pipe type cooler capable of obtaining an effective cooling effect by supplying a sufficient cooling wind to fins of a heat pipe with a simple structure. SOLUTION: In the heat pipe type cooler W1 comprising a semiconductor device 2, a block 1 having the device 2 mounted thereon to become a heat sink of the device 2, heat pipes 3 continuously provided at the block 1 to seal a refrigerant therein, a plurality of semiconductor element stacks 4 in combination with the device 2, the block 1 and the pipes 3, and an air duct 53 surrounding the pipes 3 of the stacks 4 gathering to one, one of a suction part and an exhaust part of the duct 53 or the both are each formed in a flared structure. |
