| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor cooling device in which the dimension in height direction can be reduced. SOLUTION: A semiconductor cooling device 1 and an LSI 2 which is large in heating value and required to be forcibly air-cooled are mounted together on a printed board 3. The heat dissipating fan 11 of the semiconductor cooling device 1 is equipped with an optional number of vanes which are mounted on the rotating shaft of a motor 12 to rotate. An air intake 15 is provided in the lateral direction of the motor 12, and an air vent hole 16 is provided on the side opposed to the air intake 15. A wind direction control guide 13 sends air that is taken through the air intake 15 toward the air vent hole 16 as a uniform air flow. A power supply feed terminal 14 is directly inserted into a solder through-hole bored in the printed board 3, by which all the semiconductor cooling device 1 can be fixed to the printed board 3, and an electric power is supplied to the motor 12 from the printed board 3.
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