| 摘要 |
In a method of manufacturing a resin-encapsulated semiconductor package, a protective film is formed on the surface of a semiconductor chip on which chip electrodes are formed, and openings are formed in the protective film to expose at least part of each chip electrode. Subsequently, conductive balls serving as external connecting terminals are fitted in these openings and connected to the chip electrodes, and all surfaces of the semiconductor chip and the conductive balls are encapsulated with a resin. Finally, the surface of the resin formed on the conductive balls is polished to partially expose the conductive balls. Since a mold need not have pins run against the chip electrode for forming external connecting terminals, damage to the chip electrodes and an increase in cost of the mold can be prevented, and the package can be manufactured inexpensively without deteriorating the reliability. |
