发明名称 BONDING HEATER
摘要 PROBLEM TO BE SOLVED: To provide a flip-chip bonding heater having long lifetime capable of reducing uneven temperature distribution on the heating surface when the heater is cooled while preventing the heater from deformation, damage or oxidation. SOLUTION: A bonding heater 1 includes a ceramic basic material 2 arranged with a heater part 14 buried with a heating element 12, and a holder part 15 being coupled integrally with the heater part 14 thus securing the heater part 14. A trench 16 is made in the cooling face 18 side of the holder part 15. Since a ceramic basic material (heater part 14 + holder part 15) excellent in bending resistance, fracture toughness and heat shock resistance is integrated with a heating element, reliability of strength of the bonding heater can be enhanced while taking account of thermal conduction, uniform heating and thermal radiation of the heater. Consequently, uneven temperature distribution can be reduced on the heating surface of the heater when it is cooled while prolonging the lifetime.
申请公布号 JP2000232133(A) 申请公布日期 2000.08.22
申请号 JP19990032669 申请日期 1999.02.10
申请人 NGK INSULATORS LTD 发明人 HATTORI MITSURU
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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