发明名称 Semiconductor substrate having compound semiconductor layer, process for its production, and electronic device fabricated on semiconductor substrate
摘要 In a semiconductor substrate comprising a silicon substrate having a porous region, and a semiconductor layer provided on the porous region, the semiconductor layer comprises a single-crystal compound and is formed on the surface of the porous region with its pores having been sealed at the surface. This substrate can be produced by a process comprising the steps of heat-treating the silicon substrate 11 having a porous region, to seal pores at the surface of the porous region 13, and forming a single-crystal compound-semiconductor layer 14 by heteroepitaxial growth on the porous region having the pores sealed by the heat treatment. Single-crystal compound semiconductor films with less crystal defects can be formed on large-area silicon substrates in a high productivity, a high uniformity, a high controllability and a great economical advantage.
申请公布号 US6106613(A) 申请公布日期 2000.08.22
申请号 US19980041123 申请日期 1998.03.12
申请人 CANON KABUSHIKI KAISHA 发明人 SATO, NOBUHIKO;YONEHARA, TAKAO
分类号 H01L21/20;H01L21/205;H01L21/3063;H01L31/068;H01L31/0693;H01L31/18;H01L33/34;(IPC1-7):C30B19/00 主分类号 H01L21/20
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