发明名称 |
Semiconductor substrate having compound semiconductor layer, process for its production, and electronic device fabricated on semiconductor substrate |
摘要 |
In a semiconductor substrate comprising a silicon substrate having a porous region, and a semiconductor layer provided on the porous region, the semiconductor layer comprises a single-crystal compound and is formed on the surface of the porous region with its pores having been sealed at the surface. This substrate can be produced by a process comprising the steps of heat-treating the silicon substrate 11 having a porous region, to seal pores at the surface of the porous region 13, and forming a single-crystal compound-semiconductor layer 14 by heteroepitaxial growth on the porous region having the pores sealed by the heat treatment. Single-crystal compound semiconductor films with less crystal defects can be formed on large-area silicon substrates in a high productivity, a high uniformity, a high controllability and a great economical advantage.
|
申请公布号 |
US6106613(A) |
申请公布日期 |
2000.08.22 |
申请号 |
US19980041123 |
申请日期 |
1998.03.12 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
SATO, NOBUHIKO;YONEHARA, TAKAO |
分类号 |
H01L21/20;H01L21/205;H01L21/3063;H01L31/068;H01L31/0693;H01L31/18;H01L33/34;(IPC1-7):C30B19/00 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|