| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a universal chucking mechanism for wafers, which can be used commonly to semiconductor wafers of different diameters to vacuum chuck and cut or polish the wafers. SOLUTION: Hollow communication pipes 5h having valve seats 5s of ball valves 5z at a plurality of annular grooves 4a to 4d are erected, the floatable ball valves held by upper compression springs 5j and lower compression springs 5i are present to float at a position higher than the valve seats within the communication pipes, one ends of the communication pipes at the location of the presence of the lower springs are horizontally sealed an automatic switching mechanism 5 is provided at a lower surface of a frame body 4, having a ventilation pipe communicating with central recess parts at the other ends, a hollow pipe 8 journaling these frame body 4 and an automatic switching mechanism 5 is provided, and a hollow shaft 7 is provided within a hollow shaft 8 and the shaft 7 communicates at its upper end with a central recess 5f of the automatic switching mechanism 5 and communicates at its lower end with a vacuum eguipment.</p> |
