发明名称 Molding apparatus with charge overflow
摘要 A transfer/injection molding apparatus is defined that includes a charge forming unit, a molding unit and a charge overflow unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity.
申请公布号 US6106274(A) 申请公布日期 2000.08.22
申请号 US19980038588 申请日期 1998.03.11
申请人 THE BUDD COMPANY 发明人 RITCHIE, JACK J.;FREEMAN, RICHARD BENJAMIN;INGHAM, TERRY L.;MORSE, JOHN J.;BODARY, JOSEPH A.
分类号 B29C31/08;B29C33/00;B29C43/02;B29C43/20;B29C43/34;B29C43/36;B29C43/42;B29C43/56;B29C45/00;B29C45/02;B29C45/26;B29C45/76;B29C70/46;B29K101/10;B29K105/12;(IPC1-7):B29C43/34;B29C43/54 主分类号 B29C31/08
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