发明名称 |
Polishing pad having a wear level indicator and system using the same |
摘要 |
A polishing pad having a wear level indicator and a polishing system employing the same is provided. A polishing pad, in accordance with one embodiment of the invention, includes a pad structure and an indicator, disposed in the pad structure, indicating the wear level of the pad structure. The pad structure may, for example, include a top pad and a bottom pad with the indicator being disposed in the top pad. The wear level may, for example, be a critical thickness of the polishing pad which indicates the end of the pad lifetime or which indicates the need to change polishing processing. The use of a wear level indicator allows for efficient and reliable pad wear level indication.
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申请公布号 |
US6106661(A) |
申请公布日期 |
2000.08.22 |
申请号 |
US19980074892 |
申请日期 |
1998.05.08 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
RAEDER, CHRISTOPHER H.;SHIPLEY, KEVIN D.;BURKE, PETER A. |
分类号 |
B24B37/04;B24D13/14;(IPC1-7):C23F1/02 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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