发明名称 METHOD FOR MOUNTING CIRCUIT BOARD FOR MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for mounting the circuit board of a multilayer ceramic capacitor for reducing a sound generated due to piezoelectric phenomenon and a circuit board. SOLUTION: Lands 21a, 21b, 22a, and 22b for capacitor mounting which mutually conduct are formed at the face symmetrical positions of a surface 2a and a back face 2b of a circuit board 2, and multilayer ceramic capacitors 1A and 1B with the similar specifications are surface-symmetrically arranged at the lands 21a, 21b, 22a, and 22b on the surface 2a and the back face 2b of the circuit board 2, and are conductively connected. Thus, oscillation transmitted from one capacitor 1A to the circuit board 2 and oscillation transmitted from the other capacitor 1B to the circuit board 2 can be offset, and the resonance of the circuit board 2 in response to the oscillation can be prevented. Therefore, the generation of an audible sound whose sound pressure is large can be reduced more sharply than in conventional manner.</p>
申请公布号 JP2000232030(A) 申请公布日期 2000.08.22
申请号 JP19990237334 申请日期 1999.08.24
申请人 TAIYO YUDEN CO LTD 发明人 MAMADA NOBUO
分类号 H01G4/12;H01G2/06;H05K1/02;H05K1/18;(IPC1-7):H01G2/06 主分类号 H01G4/12
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