| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which other semiconductor chips can be connected satisfactorily after their functional test is finished. SOLUTION: Pads PD for chip connection, which are to be connected to a master chip to be chip-on-chip-bonded are formed on the surface 21 of a slave chip D. Pads PT for test are connected, via respective metal interconnections 30, to the pads PD for chip connection. When the function of respective internal circuits in the slave chips D is tested. A test probe 50 is pressed to the pads PT for test. Bumps B are formed on the pads PD for chip connection.</p> |
