| 摘要 |
PROBLEM TO BE SOLVED: To provide an adherent composition which can show good adhesive properties to plastic substrates such as polycarbonate resins and epoxy resins at a relatively low curing temperature of 100 deg.C or below, for example, at 80 deg.C. SOLUTION: The composition comprises (A) a saturated hydrocarbon polymer with a number-average molecular weight of 2,000-30,000 which has at least 1.2 alkenyl groups capable of hydrosilylating in the molecule on an average, (B) an organosilicon compound containing at least 2 silicon-linked hydrogen atoms in the molecule on an average, (C) a hydrosilylating catalyst, (D) an alicyclic epoxy resin having at least 2 epoxy groups in the molecule, (E) an aluminum chelate compound, and (F) a hydrolyzable silicon compound.
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