Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation

摘要

A wafer sawing apparatus scribes a wafer having a plurality of ICs which are separated from each other by a plurality of scribe streets so as to cut the wafer into individual ICs. During scribing, silicon particles are produced and heat is generated as the scribing blade abrades the wafer surface. These silicon particles may remain on the surface of the ICs and cause defects in later manufacturing processes. Therefore, the wafer sawing apparatus has two side nozzles, one positioned on each side of the scribing blade to spray a washing solution onto the scribing blade and a top surface of the wafer through an arc having a designated angle, and a center nozzle which is positioned adjacent to and ahead of a cutting edge of the scribing blade in the driving direction, which also sprays the washing solution onto the scribing blade and the top surface of the wafer at a designated downward angle. The wafer sawing apparatus is also equipped with a suction device for suctioning the silicon particles from the top surface of the wafer, at the point where the particles are produced from the wafer by the scribing blade.