| 摘要 |
The present invention refers to circuit board (10), in particular a multilayer circuit board including at least a first carrying section (11) and a second section (12), conductor pattern (17a, 17b, 17c) and via holes (14, 14b, 14c), at least one of the sections (11; 12) comprises at least one cavity (13a, 13b) for receiving a least one electric component (15), preferably a naked circuit, the second section (11, 12) constitutes a protective cover essentially hermetical sealing of the component (15). The circuit board (10) comprises substrates of a non ceramic material and that said substrates are protected against moisture penetrating in the transverse direction of the substrates by means scaling arranged at outer edges of the substrates. |
