| 摘要 |
The present invention provides an integrated circuit comprising an insulating layer comprising the polymerization product of the aromatic dianhydride 2,2'-bis(3,4-dicarboxphenyl)hexafluoropropane dianhydride (6FDA) or the aromatic diamine 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (PFMB) with fluorine substituent-containing 4,4'-diamino-2,2'-disubstitutedbiphenyls and 2,2'-disubstituted-4,4'5,5'-biphenyltetracarboxylic dianhydrides, respectively. The present invention further provides a method of coating an integrated circuit comprising preparing a polyimide in an organic solvent, applying the polyimide dispersed within the organic solvent to the surface of the integrated circuit forming a thin insulating layer or film on the surface of the circuit; and heating the integrated circuit with the insulating polyimide layer or film disposed thereon to a temperature sufficient to evaporate the organic solvent and to cure the polyimide. The 6FDA-based and PFMB-based polyimide films of the present invention possess low dielectric constants, high coefficients of thermal expansion, excellent thermal stability and excellent solubility in conventional organic solvents. |
