发明名称 METHOD AND APPARATUS FOR PRODUCING SEMICONDUCTOR PREFORMS
摘要 Processes and molds useful for performing epoxy mold compounds are disclosed. The molds and processes reduce cycle time and compound waste by maintaining mold compound to be injected in a plasticized state during multiple molding cycles.
申请公布号 WO0047391(A1) 申请公布日期 2000.08.17
申请号 WO2000SG00021 申请日期 2000.02.10
申请人 COOKSON SEMICONDUCTOR PACKAGING MATERIALS 发明人 CHIN, NEEP, HING;KOH, KOON, HONG;LOW, WAN, TOH
分类号 B29B11/08;B29C33/04;B29C45/46;B29C45/73;H01L21/56;(IPC1-7):B29C45/46 主分类号 B29B11/08
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