发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A photosensitive resin composition which is obtained by incorporating a specific amount of a fluorescent substance into a photosensitive resin base composition and which is excellent in sensitivity, resolution, and film retention and capable of forming a satisfactory pattern. When the photosensitive resin base composition comprises at least a resin and a photosensitive substance, like a composition comprising an alkali-soluble novolak resin and a quinonediazide compound, the fluorescent substance is used in an amount of 0.0001 to 1.0 part by weight per 100 parts by weight of the photosensitive substance. When the photosensitive resin base composition comprises at least a resin and a photo-acid generator, like a resist of the positive or negative, chemical amplification type, the fluorescent substance is used in an amount of 1.0 to 30.0 parts by weight. Examples of the fluorescent substance include organic fluorescent substances such as naphthalene, anthracene, phenanthrene, pyrene, perylene, fluorene, carbazole, biphenyl, p-terphenyl, p-quaterphenyl, indole, acridine, naphthacene, rubrene, chrysene, and derivatives of these.</p>
申请公布号 WO2000048044(P1) 申请公布日期 2000.08.17
申请号 JP2000000318 申请日期 2000.01.24
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