Electronic component has terminals with leads arranged parallelly whose surface and resin surface of pad, are made offset

摘要

Several terminals are embedded under a resin pad. Leads (47) of the terminals, formed by exposing the terminal surface (47a), are arranged parallelly. A junction portion for connecting a bonding wire and the lead, is formed on the terminal surface. The terminal surface and resin surface of pad are made offset. An Independent claim is also included for electronic component manufacturing apparatus.