Process for removing particles from a table holding a semiconductor wafer during semiconductor device processing comprises placing a resin film on the table and removing the film from the table,申请号DE2000104629-传众专利搜索

发明名称	Process for removing particles from a table holding a semiconductor wafer during semiconductor device processing comprises placing a resin film on the table and removing the film from the table
摘要	Process for removing particles from a table holding a semiconductor wafer comprises placing a resin film on the table and removing the film from the table.
申请公布号	DE10004629(A1)	申请公布日期	2000.08.17
申请号	DE2000104629	申请日期	2000.02.03
申请人	FUJITSU LTD., KAWASAKI;ADVANTEST CORP., TOKIO/TOKYO	发明人	NISHIO, NAOKI;ISHIDA, KAZUSHI;TAKIGAWA, YUKIO;YANO, EI
分类号	B08B7/00;G03F7/20;H01L21/00;H01L21/027;H01L21/304;H01L21/68;H01L21/683;(IPC1-7):B08B7/04;B32B27/08	主分类号	B08B7/00
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