| 摘要 |
PURPOSE: An apparatus for cutting a mounting tape is provided which prevents the generation of remnants of the mounting tape cause during the process of cutting the mounting tape, thus blocks the broken phenomenon of a wafer in advance. CONSTITUTION: According to an apparatus(100) for cutting a mounting tape(6), a cutter supporting frame where a cutter(50) is installed is divided into a main frame(10) and a sub frame(20) possessing oblique surfaces(11,21) with an angle. In this case, the sub frame is installed on the main frame as facing its oblique surface so that it can be moved, and the main frame is fixed to an end part of a cutter rotation axis(30). Then, when the descending operation of the main frame is proceeded by the descending operation of the cutter rotation axis, the main frame pushes the sub frame to the inside of a wafer/wafer ring assembly. In this case, the cutter installed in the sub frame is pushed to the wafer/wafer ring assembly by the push operation of the main frame. In this case, the cutter is not pushed from the initial contact position of a mounting tape, although the cutter is contacted with the mounting tape and the cutter receives a certain contact impact. In addition, although the rotation operation is proceeded more than one time, the overall rotation slope is maintained uniformly. Finally, the remnants of the mounting tape generated by the change of the rotation slope of the cutter are prevented in advance.
|
