| 摘要 |
PURPOSE: An apparatus is provided to minimize a size as well as reducing a manufacturing cost by simplifying a wire bonding structure. CONSTITUTION: A collector regions(2A-2F) are connected to cathode regions(12A-12F) through switching devices(S1-S6) and diodes(D1-D6) placed on conductive heat sinks(21-26). The emitter regions(1A-1F) are connected to anode regions(11A-11F) through wires(W1). A positive pin(+) of DC power is connected heat sinks(21,23,25) through patterns(P1-P3). The patterns(P4-P6) connected to heat sinks(22,24,26) are connected to anode regions(11A-11C) through wires(W2). A pattern(P7) connected to a negative pin(-) of the DC power is connected to the anode regions(11D-11F) through wires(W3). The outer control power is applied to emitter(1A-1F) and gate(3A-3F) regions of switching devices through wires(W4,W5). Then the wire bonding structure is simplified by discriminating pattern lengths(P1-P7) of 3 phases(U,V,W) and power pins(+,-) which are not used in any other apparatus.
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