STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF, AND PACKAGE ALIGNING JIG FOR PRODUCING STACKED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is to improve yield by decreasing a package failure percent significantly without using a solder dipping process and to improve time and cost for a package assembly by a process automation. CONSTITUTION: A stacked semiconductor package comprises a first type single layer package(P1) and a second type single layer package(P2). The first type package comprises: a semiconductor chip(31) having many pads on its center; a lead(33) having one end attached to upper surface of the chip and the other end extending to outside of the chip; a wire(34) connecting the one end of the lead to the pad; and a molding part(36) surrounding the chip, the pad, the wire and a part of the lead. The second type package comprises: a semiconductor chip; a S-shaped lead(133); a wire connecting one end of the lead to the pad; and a molding part(136). A method for producing the stacked semiconductor package comprises the steps of: forming the first and second type single layer packages; attaching a solder ball to a lower surface(133d) of a substrate attaching part(133b) of the second type package; mounting the second type package onto the first type package; and reflowing the solder ball.