APPARATUS FOR CLEANING WAFER

摘要

PURPOSE: An apparatus for cleaning a wafer is provided to improve reliability of a semiconductor device by controlling a defect like a void on a metal layer even though another metal layer is stacked after cleaning the metal layer formed on a wafer. CONSTITUTION: An apparatus for cleaning a wafer comprises an overflow-type cleaning tank(11) for cleaning the wafer, a deionized water supplying pipe(22) connected to a bottom of the cleaning tank, an exhaust valve for rapid exhaust and an exhaust valve for slow exhaust. The exhaust valve for rapid exhaust is established in a first exhaust pipe connected to the bottom of the cleaning tank. The exhaust valve for slow exhaust is established in another part of the bottom of the cleaning tank to control deionized water remaining on the wafer when the wafer is cleaned in the cleaning tank longer than a cleaning time.