| 摘要 |
<p>The proposed chip contact card with adhesive bonded module has its supporting core (2) provided with a location aperture (12) in which fits a casing (11) of the chip module (1) chip (10), whereby the chip module (1) is attached to the supporting core (2) by means of adhesive means (13) being fixed between the chip module (1) substrate (7) bottom surface and the supporting core (2) upper surface. A melt, adhesive or adhesive foil represents the adhesive means (13). The card is produced in such a manner that the supporting core (2) is provided with the location aperture (12), the adhesive means (13) can be optionally put therein, then the chip module (1) is arranged thereon and the upper surface foil (3) and the bottom surface foil (4) are set in, whereupon this structural unit is laminated and in the end worked to the shape.</p> |
